Qualcomm Announces New 5G/AI Robotics RB5 Platform

Qualcomm Technologies, Inc., has announced the arrival of its new 5G/AI Robotics RB5 platform. Qualcomm press release. The new robotics platform is specifically designed for power-efficient, high performance computing robots and drones for enterprise and industrial applications and includes the Qualcomm Robotics RB5 Development Kit to offer developers ease-of-implementation, customization and flexibility.

The press release includes, of course, some quotes from several notable industry players. Among the robotics field, Softbank appears to be interested in incorporating the technology into its future products. So, maybe we’ll see it in their Whiz autonomous vacuum sweeper and the fun and entertaining Pepper, the customer service robot, and NAO, the virtual training assistant.

“SoftBank Robotics has been working in deep cooperation with Qualcomm Technologies. Our R&D will leverage the Qualcomm Robotics RB5 platform, using its power-efficient and high-end wireless connectivity features to empower our robotics roadmap.” says Xavier Lacherade, chief operating officer, SoftBank Robotics Europe.

Written by / Agency / Source: QUALCOMM, Inc.

“It’s exciting to see Qualcomm Technologies address such a broad array of robotics categories and applications with its enhanced platform, which powers the world’s largest fleet of autonomous mobile robots (AMRs) operating in indoor public spaces through its BrainOS software technology. Qualcomm Robotics RB5 platform will provide a big innovation boost to the industry at large, while enhancing San Diego’s reputation as a global hub for AI and robotics,” says Dr. Jean Baptiste Passot, vice president, platform and AI, San Diego-based Brain Corp.

Written by / Agency / Source: QUALCOMM, Inc.

No doubt, many other Qualcomm RB5 implementations will come to market too. Top on the lists of exoskeleton, robotics and drone manufacturers: intelligent data processing and fast data transmission speeds, in both inside and outside environments.

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